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 SG2011
GENERAL DESCRIPTION
The SG2011 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (110A at 300mA output) makes them attractive for battery operated power systems. The SG2011 series also offer ultra low dropout voltage (210mV at 300mA output) to prolong battery life in portable electronics. The output voltage is preset to voltages in the range of 1.5V to 5.0V. Other features include foldback current limit and thermal shut-down protection. SG2011 comes in 3-pin SOT23 and 3-pin SOT89 packages.
300mA , Low Power, Low Dropout, Linear Regulators
FEATURES
- Ultra-Low Dropout Voltage:
210mV at 300mA output
- Low 80A No-Load Supply Current - Low 110A Operating Supply Current -
at 300mA Output Thermal-Overload Protection Output Current Limit Preset Output Voltages (1.8% Accuracy) Output Voltage: Available in Fixed Outputs of 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, and 3.6V
APPLICATIONS
Cellular Telephones Digital Cameras MP3MP4 USB 2.0 Modems PC Cameras Hand-Held Instruments Electronic Dictionarys Portable/Battery-Powered Equipment
PIN CONFIGURATIONSTOP VIEW
GND
1 3 IN
OUT 2
SOT23-3
GND
IN
TYPICAL OPERATION CIRCUIT
1 OUT 2 GND 3 IN 1 GND 2 IN 3 OUT
INPUT IN CIN 1F GND OUT
OUTPUT
SOT89-3
SOT89-3(L-Type)
COUT 1F
SG Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com
REV. B
ORDERING INFORMATION
MODEL VOUT (V) PINPACKAGE SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SG2011-2.5 2.5V SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SG2011-3.3 3.3V SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) - 40C to +125C - 40C to +125C SPECIFIED TEMPERATURE RANGE - 40C to +125C ORDERING NUMBER SG2011-1.5XN3/TR SG2011-1.5XK3/TR SG2011-1.5XK3L/TR SG2011-1.8XN3/TR SG2011-1.8XK3/TR SG2011-1.8XK3L/TR SG2011-2.5XN3/TR SG2011-2.5XK3/TR SG2011-2.5XK3L/TR SG2011-2.8XN3/TR SG2011-2.8XK3/TR SG2011-2.8XK3L/TR SG2011-3.0XN3/TR SG2011-3.0XK3/TR SG2011-3.0XK3L/TR SG2011-3.3XN3/TR SG2011-3.3XK3/TR SG2011-3.3XK3L/TR SG2011-3.6XN3/TR SG2011-3.6XK3/TR SG2011-3.6XK3L/TR PACKAGE MARKING XB15 SG2011-1.5XK3 SG2011-1.5XK3L XB18 SG2011-1.8XK3 SG2011-1.8XK3L XB25 SG2011-2.5XK3 SG2011-2.5XK3L XB28 SG2011-2.8XK3 SG2011-2.8XK3L XB30 SG2011-3.0XK3 SG2011-3.0XK3L XB33 SG2011-3.3XK3 SG2011-3.3XK3L XB36 SG2011-3.6XK3 SG2011-3.6XK3L PACKAGE OPTION Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000
SG2011-1.5
1.5V
SG2011-1.8
1.8V
- 40C to +125C
SG2011-2.8
2.8V
- 40C to +125C
SG2011-3.0
3.0V
- 40C to +125C
SG2011-3.6
3.6V
- 40C to +125C
ABSOLUTE MAXIMUM RATINGS
IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration............................................Infinite OUT to GND...................................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25 SOT23-3 .....................................................................................0.4W SOT89-3 ................................................................................0.571W Package Thermal Resistance SOT23-3, JA....................................................................... 250/W SOT89-3, JA.........................................................................175C/W Operating Temperature Range............................- 40C to +125C Junction Temperature...........................................................+150C Storage Temperature.............................................- 65C to +150C Lead Temperature (soldering, 10s).......................................260C ESD Susceptibility HBM..........................................................................................7000V MM..............................................................................................400V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PIN DESCRIPTION
NAME IN GND OUT FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Ground. Regulator Output.
SG2011
ELECTRICAL CHARACTERISTICS
(VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), TA = - 40C to +125C, unless otherwise noted. Typical values are at TA = + 25C.) PARAMETER Input Voltage SYMBOL VIN IOUT = 0.1mA, TA = +25C IOUT = 0.1mA to 300mA, Output Voltage Accuracy TA = 0C to +70C IOUT = 0.1mA to 300mA, TA = - 40C to +125C Output Current Current Limit Ground Pin Current Dropout Voltage(Note1) Line Regulation Load Regulation Output Voltage Noise Power Supply Rejection Rate THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis TSHDN TSHDN 160 15 VLNR VLDR ILIM IQ No load IOUT = 300mA IOUT = 1mA IOUT = 300mA VIN = 2.5V or (VOUT + 0.1V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1F f = 10Hz to 100KHz, COUT = 10F ILOAD = 50mA, COUT = 1F f = 100Hz, f = 1KHz, 300 310 750 80 110 0.8 210 0.004 0.0005 120 74 54 340 0.15 0.002 140 CONDITIONS MIN 2.5 -1.8 TYP MAX 5.5 1.8 2.5 2.9 mA mA A mV %/V %/mA VRMS dB dB % UNITS V
en
PSRR
Specifications subject to change without notice.
Note 1: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V)
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1F, COUT = 1F, TA = +25, unless otherwise noted.
Ground Pin Current vs.Input Voltage 100 80 60 No Load 40 20 VOUT = 2.5V 0 0 1 2 3 4 Input Voltage(V) 5 6 Iload = 50mA
Ground Pin Current vs.Input Voltage 200
Ground Pin Current(A)
Ground Pin Current(A)
150
Iload = 50mA
100
50
No Load VOUT = 3.3V
0 0 1 2 3 4 Input Voltage(V) 5 6
Output Voltage vs.Input Voltage 6 No Load 5
Ground Pin Current vs.Load Current 160 150 140 Ground Current(A) 130 120 110 100 90 80 70 60 VOUT = 2.5V VOUT = 3.3V
Output Voltage(V)
4 VOUT = 3.3V 3 2 VOUT = 2.5V 1 0 0 1 2 3 4 Input Voltage(V) 5 6
0
50
100 150 200 Load Current(mA)
250
300
Output Voltage vs.Load Current 2.6
3.35
Output Vlotage vs.Load Current
Output Voltage(V)
Output Voltage(V)
2.55
3.325
2.5
3.3
2.45 VOUT = 2.5V 2.4 0 100 200 Load Current(mA) 300
3.275 VOUT = 3.3V 3.25 0 100 200 Load Current(mA) 300
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1F, COUT = 1F, TA = +25, unless otherwise noted.
Line-Transient Response 4.5V 3.5V ILOAD = 150mA 3.1V 3V 2.9V VOUT 50mA 0mA VOUT = 3V 100S/div VIN 3.05V 3V 2.95V
Load-Transient Response VIN = VOUT + 0.5V ILOAD = 0mA to 50mA CIN = 1F VOUT
ILOAD VOUT = 3V 40S/div
Load-Transient Response Near Dropout 3.05V 3V 2.95V VOUT = 3V VOUT
Power-Supply Rejection Ratio vs.Frequency 80 70 60 PSRR(dB) 50 40 30 20 10 0 0.01 COUT = 1F COUT = 10F ILOAD = 50mA
50mA 0mA CIN = 1F VIN = VOUT + 0.1V ILOAD = 0mA to 50mA 40S/div ILOAD
0.1
1
10
100
1000
Frequency(kHz)
Region of Stable COUT ESR vs.Load Current 100
1200 1100 Current limit(mA)
Current limit vs.Temperature VOUT = 3.3V
10 COUT ESR()
COUT = 10F
1000 900 800 700 600 500 400 300
1 Stable Region 0.1
COUT = 1F
0.02 0.01 0 50 100 150 200 Load Current(mA) 250 300
-40 -20
0
20 40 60 80 Temperature()
100 120 140
SG2011
TYPICAL OPERATING CHARACTERISTICS
VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1F, COUT = 1F, TA = +25, unless otherwise noted.
Output Voltage vs.Temperature 2.6 ILOAD = 300mA Output Voltage(V) 2.55 Output Voltage(V)
Output Voltage vs.Temperature 3.4 ILOAD = 300mA 3.35
2.5
3.3
2.45 VOUT = 2.5V 2.4 -40 -20 0 20 40 60 80 Temperature() 100 120 140
3.25 VOUT = 3.3V 3.2 -40 -20 0 20 40 60 80 100 120 140 Temperature()
Ground Pin Current vs.Temperature 200 180 Ground Pin Current(A)
Dropout Voltage vs.Load Current 360 320 Dropout Voltage(mV)
160 140 120 100 80 60 40 -40 -20 0
VOUT = 3.3V
280 240 200 160 120 80 40 0 0 30 60
TA = +125
TA = +85 TA = +25 TA = -40
VOUT = 2.5V
ILOAD = 300mA 20 40 60 80 Temperature() 100 120 140
VOUT = 2.5V 90 120 150 180 210 240 270 300 Load Current(mA)
Dropout Voltage vs.Load Current 350
Input Voltage(V) 6 4 2 0 Output Voltage(V) 2 1 0
Start Up VOUT = 2.5V ILOAD = 1mA
300 Dropout Voltage(mV) 250 200 150 100 50 0 0 50 100 150 200 250 300 Load Current(mA) VOUT = 3.3V TA = -40
TA = +125
TA = +85 TA = +25
Time(10s/div)
SG2011
Application Notes
When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SG2011. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below:
Vcc Input BZM55B5V6 1uF C1
IN
SG2011
GND
VOUT C2 4.7uF
VOUT
SG2011
PACKAGE OUTLINE DIMENSIONS
SOT23-3
D b L
0
0.20
Symbol
A A1
Dimensions In Millimeters Min
1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.650 1.800 0.300 0
Dimensions In Inches Min
0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.104 0.071 0.012 0
Max
1.250 0.100 1.150 0.400 0.200 3.020 1.700 2.950 2.000 0.600 8
Max
0.049 0.004 0.045 0.016 0.008 0.119 0.067 0.116 0.079 0.024 8
E1
A2 b c D E
E
e e1 A1 C
L
E1 e e1 L
0.950TYP 0.700REF
0.037TYP 0.028REF
A2
A
L1
SG2011
PACKAGE OUTLINE DIMENSIONS
SOT89-3
D D1 A
Symbol
A b b1 c D D1 E E1 e e1 L
Dimensions In Millimeters Min Max
1.400 1.600 0.320 0.520 0.360 0.560 0.350 0.440 4.400 4.600 1.400 1.800 2.300 2.600 3.940 4.250 1.500TYP 2.900 3.100 0.900 1.100
Dimensions In Inches Min Max
0.055 0.063 0.013 0.020 0.014 0.022 0.014 0.017 0.173 0.181 0.055 0.071 0.091 0.102 0.155 0.167 0.060TYP 0.114 0.122 0.035 0.043
E1
L
b e1
e c
E
SG2011
REVISION HISTORY
Location 9/05-- Data Sheet changed from preliminary to REV. A 12/06-- Data Sheet changed from REV. A to REV. B
Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Page
Shengbang Microelectronics Co, Ltd
Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com
SG2011


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